MP1423 – 3A, 23V, 385KHz STEP-DOWN CONVERTER

MP1423 Rev. 1.1

www.MonolithicPower.com

10

1/6/2006

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© 2006 MPS. All Rights Reserved.

TM

PACKAGE INFORMATION

SOIC8N (EXPOSED PAD)

NOTE:

1) Control dimension is in inches. Dimension in bracket is millimeters.

2) Exposed Pad Option (N-Package) ; 2.31mm -2.79mm x 2.79mm - 3.81mm.

Recommend Solder Board Area: 2.80mm x 3.82mm = 10.7mm2 (16.6 mil2)

3) The length of the package does not include mold flash. Mold flash shall not exceed 0.006in. (0.15mm) per side.

With the mold flash included, over-all length of the package is 0.2087in. (5.3mm) max.

4) The width of the package does not include mold flash. Mold flash shall not exceed 0.10in. (0.25mm) per side.

With the mold flash included, over-all width of the package is 0.177in. (4.5mm) max.

0.016(0.410)

0.050(1.270)

0o-8o

DETAIL "A"

0.011(0.280)

0.020(0.508)

x 45o

SEE DETAIL "A"

0.0075(0.191)

0.0098(0.249)

0.229(5.820)

0.244(6.200)

Land Pattern

.028

.050

0.140 (3.55mm)

0.200 (5.07 mm)

0.060

0.150(3.810)

0.157(4.000)

PIN 1 IDENT.

0.050(1.270)BSC

0.013(0.330)

0.020(0.508)

NOTE 2

NOTE 4

SEATING PLANE

0.001(0.030)

0.004(0.101)

0.189(4.800)

0.197(5.000)

0.053(1.350)

0.068(1.730)

0.049(1.250)

0.060(1.524)

NOTE 3