5.4 Thermal Information: TLV387

THERMAL METRIC(1)

TLV387

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

187.1

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

107.4

°C/W

RθJB

Junction-to-board thermal resistance

57.5

°C/W

ψJT

Junction-to-top characterization parameter

33.5

°C/W

ψJB

Junction-to-board characterization parameter

57.1

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Thermal Information: TLV2387

THERMAL METRIC(1)

TLV2387

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

165

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

53

°C/W

RθJB

Junction-to-board thermal resistance

87

°C/W

ΨJT

Junction-to-top characterization parameter

4.9

°C/W

ΨJB

Junction-to-board characterization parameter

85

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.6 Thermal Information: TLV4387

THERMAL METRIC(1)

TLV4387

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

109.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

27.4

°C/W

RθJB

Junction-to-board thermal resistance

56.1

°C/W

ΨJT

Junction-to-top characterization parameter

1.5

°C/W

ΨJB

Junction-to-board characterization parameter

54.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TLV387, TLV2387

SBOSA91A – DECEMBER 2021 – REVISED NOVEMBER 2023

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Product Folder Links: TLV387 TLV2387