LPC47N227 datasheet(4/5 Pages) SMSC

4 / 5 page

100 Pin Super I/O with LPC Interface for Notebook Applications

Rev. 03-29-07

Page 4

SMSC DB – LPC47N227

PRODUCT PREVIEW

PACKAGE OUTLINES

FIGURE 1 – 100 PIN TQN LEAD-FREE PACKAGE OUTLINE

MIN

NOMINAL

MAX

REMARK

1.60

Overall Package Height

0.05

Standoff

1.35

1.40

1.45

Body Thickness

15.80

16.00

16.20

X Span

D/2

7.90

8.00

8.10

2 X Span Measure from Centerline

13.90

14.00

14.10

X body Size

15.80

16.00

16.20

Y Span

E/2

7.90

8.00

8.10

2 Y Span Measure from Centerline

13.90

14.00

14.10

Y body Size

0.20

Lead Frame Thickness

0.45

0.60

0.75

Lead Foot Length from Centerline

1.00

Lead Length

0.50 Basic

Lead Pitch

Lead Foot Angle

0.25

Lead Width

0.20

Lead Shoulder Radius

0.20

Lead Foot Radius

ccc

0.0762

Coplanarity (Assemblers)

ccc

0.08

Coplanarity (Test House)

Notes:

1 Controlling Unit: millimeter

2 Tolerance on the position of the leads is ± 0.04 mm maximum.

3 Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm.

4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-

1.08 mm.

5 Details of pin 1 identifier are optional but must be located within the zone indicated.

6 Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.

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