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ISP1107 데이터시트(PDF) 19 Page - NXP Semiconductors |
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ISP1107 데이터시트(HTML) 19 Page - NXP Semiconductors |
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19 / 19 page ![]() © Philips Electronics N.V. 2000. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 23 February 2000 Document order number: 9397 750 06899 Contents Philips Semiconductors ISP1107 Advanced USB transceiver 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Operating functions. . . . . . . . . . . . . . . . . . . . . . 5 7.3 Power supply configurations. . . . . . . . . . . . . . . 5 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 11 Test information. . . . . . . . . . . . . . . . . . . . . . . . 11 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13.1 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 13.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15 13.5 Package related soldering information . . . . . . 15 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 |
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