AM29DL640G30PCEN datasheet(55/56 Pages) SPANSION

55 / 56 page

June 6, 2005

Am29DL640G

REVISION SUMMARY

Revision A (November 7, 2001)

Initial release.

Revision A+1 (April 15, 2002)

Global

Changed data sheet status from Advance Information

to Preliminary.

Ordering Information

Changed package marking for Fortified BGA (ordering

designator is PC).

Revision A+2 (June 7, 2002)

Global

Added 65 ns speed option.

Revision B (September 13, 2002)

Global

Removed Preliminary designation from data sheet.

Revision B+1 (October 21, 2002)

Connection Diagrams

On 64-ball Fortified BGA package, changed first row

and last row to NC in pin diagram.

On 48-ball Fine-pitch BGA package, applied note with

asterisk to top left hand NC balls.

Special Handling Instructions

Changed wording to include TSOP and BGA pack-

ages.

Ordering Information

Removed FBGA designation from the PC and WH

package type.

SecSi Sector Flash Memory Region, and Enter

SecSi Sector/Exit SecSi Sector Command

Sequence

Noted that the A

CC function and unlock bypass modes

are not available when the SecSi sector is enabled.

Byte/Word Program Command Sequence, Sector

Erase Command Sequence, and Chip Erase Com-

mand Sequence

Noted that the SecSi Sector, autoselect, and CFI func-

tions are unavailable when a program or erase opera-

tion is in progress.

Common Flash Memory Interface (CFI)

Changed wording in last sentence of third paragraph

from, “...the autoselect mode.” to “...reading array

data.”

Changed CFI website address.

Command Definitions

Changed wording in last sentence of first paragraph

from, “...resets the device to reading array data.”

to...”may place the device to an unknown state. A reset

command is then required to return the device to read-

ing array data.”

Table 12. Am29DL640G Command Definitions

Changed the first address of the unlock bypass reset

command sequence from BA to XXX.

CMOS Compatible

Added I

LR parameter to table.

Deleted I

ACC parameter from table.

AC Characteristics and Read-Only Operations

Changed the Chip Enable to Output High Z and Out-

put Enable to Output High Z Speed Options from 30

ns to 16 ns.

Word/Byte Configuration

Changed BYTE# Switching Low to Output High Z

Speed Options from 30 ns to 16 ns.

TSOP Pin Capacitance

Changed all typicals and maximums in table.

Added fine-pitch BGA capacitance.

Global

Removed 65 ns speed option.

Revision B+2 (November 11, 2002)

Customer Lockable: SecSi Sector NOT

Programmed or Protected at the factory.

Added second bullet, SecSi sector-protect.

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