USB3300 datasheet(49/49 Pages) SMSC

49 / 49 page

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface

Datasheet

SMSC USB3300

Revision 1.06 (07-19-06)

DATASHEET

Chapter 8 Package Outline

The USB3300 is offered in a compact 32 pin lead-free QFN package.

Notes:

1. Controlling Unit: millimeter.

2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the

terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material

conditions (MMC).

3. Details of terminal #1 identifier are optional but must be located within the zone indicated.

4. Coplanarity zone applies to exposed pad and terminals.

Figure 8.1 USB3300-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free)

Table 8.1 32 Terminal QFN Package Parameters

MIN

NOMINAL

MAX

REMARKS

0.70

1.00

Overall Package Height

0.02

0.05

Standoff

0.90

Mold Thickness

0.20 REF

Copper Lead-frame Substrate

4.85

5.0

5.15

X Overall Size

4.55

4.95

X Mold Cap Size

3.15

3.3

3.45

X exposed Pad Size

4.85

5.0

5.15

Y Overall Size

4.55

4.95

Y Mold Cap Size

3.15

3.3

3.45

Y exposed Pad Size

0.30

0.50

Terminal Length

0.50 BSC

Terminal Pitch

0.18

0.25

0.30

Terminal Width

ccc

0.08

Coplanarity

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