LTM4712

2

Rev. 0

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PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, VOUT, ISP, ISN, EXTVCC....................... –0.3V to 38V

SW1, SW2.................................................. –0.3V to 38V

RUN ............................................................–0.3V to 12V

INTVCC, PGOOD........................................... –0.3V to 6V

PHMODE, ISET, IMON, FB.....................–0.3V to INTVCC

MODE, SS, COMPa, COMPb .................–0.3V to INTVCC

FREQ, SYNC, CLKOUT...........................–0.3V to INTVCC

Maximum Junction Temperature

(Notes 2, 3)........................................ –40°C to 125°C

Storage Temperature.............................. –55°C to 125°C

Peak Solder Reflow Body Temperature ................. 245°C

(Note 1)

TOP VIEW

GND

INTVCC EXTVCC

VIN

RUN

COMPb

COMPa

SW2

SGND

FB

GND

VOUT

GND

SW1

SGND

SGND

SGND

SGND

SYNC

ISET

ISN

ISP

PGOOD

SS

MODE

PHMODE

FREQ

CLKOUT

IMON

CSP_BGA PACKAGE

144-PIN (16mm × 16mm × 8.34mm)

θJCtop = 9°C/W, θJCbottom = 4.2°C/W, θJA = 9°C/W

θ VALUES DEFINED PER JESD 51-12,

WEIGHT = 7.4g (TYP.)

GND

GND

1

2

3

4

5

6

7

8

9

10

11

12

M

L

K

J

H

G

F

E

D

C

B

A

GND

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH*

PART MARKING

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4712EY#PBF

SAC305 (RoHS)

LTM4712Y

e1

BGA

4

–40°C to 125°C

LTM4712IY#PBF

SAC305 (RoHS)

LTM4712Y

e1

BGA

4

–40°C to 125°C

• Contact the factory for parts specified with wider operating temperature ranges.

*Pad or ball finish code is per IPC/JEDEC J-STD-609.

• This product is not recommended for second side reflow.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings