1997 Mar 03

19

Philips Semiconductors

Objective specification

Stand-alone OSD for monitor applications

PCB8517

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT38-4

92-11-17

95-01-14

c

(e )

1

A

L

e

D

Z

16

1

9

8

E

pin 1 index

b

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.73

1.30

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

0.76

4.2

0.51

3.2

inches

0.068

0.051

0.021

0.015

0.014

0.009

1.25

0.85

0.049

0.033

0.77

0.73

0.26

0.24

0.14

0.12

0.01

0.10

0.30

0.32

0.31

0.39

0.33

0.030

0.17

0.020

0.13

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4