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STTH112U 데이터시트(PDF) 3 Page - STMicroelectronics

부품명 STTH112U
상세설명  High voltage ultrafast rectifier
PDF  7 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STTH112U 데이터시트(HTML) 3 Page - STMicroelectronics

  STTH112U Datasheet HTML 1Page - STMicroelectronics STTH112U Datasheet HTML 2Page - STMicroelectronics STTH112U Datasheet HTML 3Page - STMicroelectronics STTH112U Datasheet HTML 4Page - STMicroelectronics STTH112U Datasheet HTML 5Page - STMicroelectronics STTH112U Datasheet HTML 6Page - STMicroelectronics STTH112U Datasheet HTML 7Page - STMicroelectronics  
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STTH112
Electrical characteristics
3/7
Figure 3.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4,
Lleads = 10mm) (DO-41).
Figure 4.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA).
Z/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
T
δ=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Z/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
T
δ=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Figure 5.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4)(SMB).
Figure 6.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35 µm) (DO-41, SMB).
Figure 7.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA).
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Z/R
th(j-c)
th(j-c)
T
δ=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
012
34567
89
10
S(cm²)
DO-41
L
=10mm
leads
SMB
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
S(cm²)
SMA



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