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PCF2116CU/12 데이터시트(PDF) 57 Page - NXP Semiconductors |
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PCF2116CU/12 데이터시트(HTML) 57 Page - NXP Semiconductors |
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57 / 64 page ![]() 1997 Apr 07 57 Philips Semiconductors Product specification LCD controller/drivers PCF2116 family 19 BONDING PAD LOCATIONS handbook, full pagewidth MLB969 ≈ 6.99 mm ≈ 5.64 mm x PCF2114 PCF2116 y 0 0 C1 R24 R23 R22 R21 R20 R19 R18 R17 R8 R7 R6 R5 R4 R3 R2 R1 C31 C32 C30 C33 C34 C35 C36 C37 C38 C39 C40 C41 C42 C43 C44 C45 C47 C48 C46 C49 C50 C51 C52 C53 C54 C55 C56 C57 C58 C59 C60 R32 DB7 SCL DB6 SDA DB5 0 LCD1 DB4 LCD2 DB3 LCD3 DB2 V V V V Fig.40 Bonding pad locations. Chip dimensions: approximately 5.64 × 6.99 mm. Pad area: 0.0121 mm2. Bonding pad dimensions: 110 × 110 µm. |
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