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PCF8566 데이터시트(PDF) 31 Page - NXP Semiconductors |
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PCF8566 데이터시트(HTML) 31 Page - NXP Semiconductors |
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31 / 40 page ![]() 1998 May 04 31 Philips Semiconductors Product specification Universal LCD driver for low multiplex rates PCF8566 13 CHIP DIMENSIONS AND BONDING PAD LOCATIONS Fig.25 Bonding pad locations. (1) Typical value. Pad size: 120 × 120 µm Chip area: 7.27 mm. The numbers given in the small squares refer to the pad numbers. handbook, full pagewidth MBH783 y 2.5 mm(1) x 0 0 PCF8566 36 37 38 39 40 5 4 3 2 1 25 24 23 22 21 16 15 14 2.91(1) mm 13 12 11 10 17 18 19 20 9 8 7 6 30 31 32 33 34 35 26 27 28 29 SA0 A2 A1 A0 OSC S16 S17 S18 VSS VLCD BP0 BP2 BP1 S11 S10 S9 S12 S14 S13 S15 |
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