2000 Feb 04

18

Philips Semiconductors

Product specification

LCD driver for 140

× 2 segments

PCF8801

TRAY INFORMATION

handbook, full pagewidth

MGL928

D

C

A

x

y

F

E

B

Fig.8 Tray details.

For the dimensions of x, y and A to F, see Table 7.

Table 6

Bonding pad dimensions

Table 7

Tray dimensions

handbook, halfpage

MGL929

PCF8801

Fig.9 Tray alignment.

The orientation of the IC in a pocket is indicated by the

position of the IC type name on the die surface with respect to

the chamfer on the upper left corner of the tray. Refer to Fig.6

for the orientation and position of the type name on the die

surface.

Pad pitch

min. 75

µm

Pad size, aluminium

62

× 100 µm

Bump dimensions

50

× 90 × 17.5 (±5) µm

Wafer thickness

approx. 380

µm

DIM.

DESCRIPTION

VALUE

A

pocket pitch, in the x direction

13.97 mm

B

pocket pitch, in the y direction

3.20 mm

C

pocket width, in the x direction

11.66 mm

D

pocket width, in the y direction 1.30 mm

E

tray width, in the x direction

50.80 mm

F

tray width, in the y direction

50.80 mm

x

no. pockets in the x direction

3

y

no. pockets in the y direction

14