ZXMP3A13F

ISSUE 1 - MAY 2007

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to ambient (a)

200

°C/W

Junction to ambient (b)

155

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 5 secs.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10 s - pulse width limited by maximum junction temperature. Refer to

Transient Thermal Impedance graph.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

-30

V

Gate Source Voltage

20

V

-1.6

-1.3

-1.4

A

Pulsed Drain Current (c)

-6

A

Continuous Source Current (Body Diode) (b)

-1.2

A

Pulsed Source Current (Body Diode) (c)

-6

A

Linear Derating Factor

625

5

mW

mW/°C

Linear Derating Factor

806

6.4

mW

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS