Philips Semiconductors

Product specification

PDIUSBD11

USB device with serial interface

1999 Jul 22

18

SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS

Mo nting

Package

Soldering Method

Mounting

Package

Wave

Dipping

Through-hole mount

DBS, DIP, HDIP, SDIP, SIL

–

suitable

BGA, SQFP,

not suitable

suitable

–

HLQFP, HSQFP, HSOP, SMS

suitable

–

Surface mount

PLCC, SO, SOJ

suitable

suitable

–

LQFP, QFP, TQFP

suitable

–

SSOP, TSSOP, VSO

suitable

–

NOTES:

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to

time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in

them (the so-called “popcorn” effect). For details, refer to the Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages;

Section: Packing Methods”.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version)

cannot be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave direction. The package footprint must

incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP, and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pith (e) equal to or larger than 0.65 mm; it is definitely not suitable for

packages with a pitch (e) equal to or smaller than 0.5 mm.