TMG3992 datasheet(88/96 Pages) OSRAM

부품명	TMG3992

상세설명	Gesture, Color, ALS, and Proximity Sensor Module with mobeam™ Barcode Emulation

PDF	96 Pages

Scroll/Zoom	100%

제조업체	OSRAM [OSRAM GmbH]

홈페이지	http://www.osram.com

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88 / 96 page

ams Datasheet

Page 87

[v1-06] 2018-Feb-27

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TMG3992 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 92:

Soldering Profile

Figure 93:

Soldering Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5 ºC/s

Soak time

tsoak

2 to 3 minutes

Time above 217 ºC (T1)t1

Max 60 s

Time above 230 ºC (T2)t2

Max 50 s

Time above Tpeak - 10 ºC (T3)t3

Max 10 s

Peak temperature in reflow

Tpeak

260 ºC

Temperature gradient in cooling

Max -5 ºC/s

Soldering & Storage

Information

(s)

TMG3992 데이터시트(PDF) 88 Page - OSRAM GmbH