Philips Semiconductors

Objective specification

PowerMOS transistor

PHT1N52S

MOUNTING INSTRUCTIONS

Dimensions in mm.

Fig.1. soldering pattern for surface mounting SOT223.

PRINTED CIRCUIT BOARD

Dimensions in mm.

Fig.2. PCB for thermal resistance and power rating for SOT223.

PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35

µm thick).

3.8

min

6.3

2.3

4.6

1.5

min

1.5

min

1.5

min

(3x)

36

60

9

10

4.6

18

4.5

7

15

50

February 1998

3

Rev 1.000