DATA SHEET

SE2547A: Dual-Band 802.11a/b/g/n Wireless LAN Front-End

Preliminary Information

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

202421A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012

13

Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption

may occur when the part is subjected to high temperature during solder assembly. The SE2547A is capable of

withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or

in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that

the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For

details on both attachment techniques, precautions, and handling procedures recommended, please refer to:



“Land Grid Array Module Solder Reflow & Rework Information”, Document Number QAD-00046



“Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number QAD-00047

Product Branding

Figure 7: SE2547A Branding Information

SiGe

2547A

Lot Code

Pin 1 Identifier

Part

Lot

Pin 1

e4

Terminal Finish

Caution! Class 0 ESD sensitive device