Silicon Flip Chip PIN Diode

MA4FCP305

V 3.00

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or information contained herein without notice.

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2

1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance, Cp.

3. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package.

4. Steady-state thermal resistance measured with die mounted in an ODS-186 package.

Parameters @ Conditions

Symbol

Units

Min.

Typ.

Max.

Total Capacitance @ -10 V, 1 MHz

1

pF

0.060

Total Capacitance @ -10 V, 1 GHz

1,3

pF

0.050

Series Resistance @ +50 mA

Ω

1.7

Series Resistance @ +50 mA

Ω

2.1

Forward Voltage @ +100 mA

V

1.05

1.25

Reverse Voltage @ -10

µ A

V

-40

-50

Reverse Current @ -40 V

µ A

10

50 - 90% Lifetime @ +10 mA / -6 mA

TL

ns

25

Steady State Thermal Resistance

4

θ

° C/W

640

Mounting Techniques

These devices were designed for insertion onto hard or soft

substrates with the junction side down. They can be mounted

with electrically conductive epoxy or with a low temperature

solder preform.

The die can also be assembled with the

junction side up, and wire or ribbon bonds made to the pads.

Solder Die Attach Using

Electrically Conductive Ag Epoxy

and Solder

These chips are designed to be inserted onto hard or soft

substrates with the junction side down. They should be

mounted onto silkscreened circuits using

Electrically

Conductive Ag Epoxy, approximately 1-2 mils in thickness

and

cured

at

approximately

90

°C

to

150

°C

per

manufacturer’s schedule . For extended cure times >30

minutes, temperatures must be below 200 °C.

Sn Rich Solders are not recommended due to the Tungsten

Metallization scheme beneath the gold contacts. Indalloy or

80 Au/20 Sn Solders are acceptable. Maximum soldering

temperature must be <300 °C for <10 sec.

Assembly Considerations

The following precautions should be observed for successful

assembly of the die.

Cleanliness

These chips should be handled in a clean environment. Do not

attempt to clean die after installation.

ESD

These devices very susceptible to ESD and are rated Class 0

(0-199

V)

per

HBM

MIL-STD-883,

method

3015.7

[C = 100 pF

pass 100 V ESD, they must be handled in a static-free

environment

General Handling

The protective polymer coating on the active areas of these

devices provides scratch protection, particularly for the metal

airbridge that contacts the anode. Die can be handled with

tweezers or vacuum pickups and are suitable for use with

automatic pick-and-place equipment.