Surface Mount PIN Diode Chip

MA4SPS552 SurMount

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2

V 1.00

Electrical Specifications: @ +25 °C

Symbol

Conditions

Units

Min.

Typ.

Max.

-40 V, 1 MHz

pF

0.08

0.14

-40 V, 1 GHz

pF

0.06

100 mA, 100 MHz

Ω

1.7

20 mA, 100 MHz

Ω

2.4

100 mA

V

1.00

1.25

10 mA

V

0.86

1.00

-10

µA

V

l -200 l

l -275 l

-40 V

nA

l -10 l

Steady State

°C/W

30

(50% - 90% V)

+10 mA / -6 mA

µs

2.5

Parameter

Total

Capacitance

Total

Capacitance

Series

Resistance

Series

Resistance

Forward Voltage

Forward Voltage

Reverse Voltage

Reverse Leakage

Current

Thermal

Resistance

Minority Carrier

Lifetime

Handling Procedures

All semiconductor chips should be handled with care to avoid

damage or contamination from perspiration and skin oils.

The use of plastic tipped tweezers or vacuum pickups is

strongly recommended for individual components.

Bulk

handling should insure that abrasion and mechanical shock

are minimized.

Bonding Techniques

Attachment to a circuit board is made simple through the use

of

surface

mount

technology.

Mounting

pads

are

conveniently located on the bottom surface of these diodes

and are removed from the active junction locations. These

devices are well suited for solder attachment onto hard and

soft substrates.

The use of 80/20 Au/Sn and 60/40 Sn/Pb

solder is recommended, with an equal temperature profile

across the contacts. Conductive epoxy paste for attachment

may also be used.

When soldering these devices to a hard substrate, hot gas

die bonding is preferred.

We recommend utilizing a

vacuum tip and a force of 60 to 100 grams applied

normal to the top surface of the device. When soldering

to soft substrates, it is recommended to use a lead-tin

interface at the circuit board mounting pads. Position

the die so that its mounting pads are aligned with the

circuit board’s mounting pads and reflow the solder by

heating the circuit trace near the mounting pad while

applying 60 to 100 grams of force perpendicular to the

top surface of the die.

Since the HMIC™ glass is transparent, the edges of the

mounting pads closest to each other can be visually

inspected through the die after attach is completed.