1.25 W VSAT Power Amplifier

13.75—14.5 GHz

MAAPSS0111

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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Visit www.macom.com for additional data sheets and product information.

V2P

3

RoHS

Compliant

Notes on board design:

1.

2.

A substrate thickness of 20 mils (0.508 mm) maximum is recommended to minimize thermal resistance and

ground impedances.

3.

RF transmission line impedance must be 50 ohms (w = 42 mils (1.0668 mm) for t = 20 mils (0.508 mm),

Rogers 4003).

4.

The board must provide low thermal resistance from package base to heat sink to accommodate the 3 W

typical power dissipation.

5.

Metal foil thickness in the vias is critical to thermal resistance. The recommended metalization is 1 oz

(35 mm minimum thickness).

6.

The application board is configured with 36 vias, each 12 mil (0.3048 mm) in diameter beneath the package

base. Conductive via fill material is recommended to minimize thermal resistance and to prevent solder from

wicking into vias.

7.

The exposed package pad must be properly soldered to the board.

8.

Case temperature is measured at the interface between the package bottom and circuit board.

Evaluation Test Board

Designator

Value

Foot Print

C1, C10

1 uF

0402

C2, C9

10 pF

0402

C3, C8

10 uF

0804

C4, C7

0.1 uF

0402

C5, C6

100 pF

0402

External Parts List

Cross Section View