TMP112BIDRLR datasheet(29/47 Pages) TI1

29 / 47 page

Controller

TMP112D0

TMP112D1

TMP112D2

TMP112D3

SCL

SDA

SCL

SDA

V+

GND

1.2 k

0.1 µF

1.4 V to 3.6 V

5.0 k

ALERT

TMP112D

SCL

SDA

V+

GND

ADD0

ALERT

variant

ADDRESS

variant

Figure 8-2. Typical Connections (X2SON-5 Package)

8.2.1 Design Requirements

The TMP112 family requires pullup resistors on the SCL, SDA, and ALERT pins. The recommended value for

the pullup resistors is 1.2 kΩ and 5 kΩ. In some applications the pullup resistor can be lower or higher than 5

kΩ but must not exceed 3 mA of current on any of those pins. A 0.01-μF (for SOT563-6 package) or 0.1-μF (for

X2SON-5 package) bypass capacitor on the supply is recommended as shown in Figure 8-1 and Figure 8-2. The

SCL and SDA lines can be pulled up to a supply that is equal to or higher than V+ through the pullup resistors.

To configure one of four different addresses on the bus, connect the ADD0 pin to either the GND, V+, SDA, or

SCL pin. The TMP112Dx also provides four different address options when only ALERT pin is used.

8.2.2 Detailed Design Procedure

Place the device in close proximity to the heat source that must be monitored, with a proper layout for good

thermal coupling. This placement verifies that temperature changes are captured within the shortest possible

time interval. To maintain accuracy in applications that require air or surface temperature measurement, take

care to isolate the package and leads from ambient air temperature. A thermally-conductive adhesive is helpful

in achieving accurate surface temperature measurement.

The TMP112 family is a very low-power device and generates very low noise on the supply bus. Applying an

RC filter to the V+ pin of the TMP112 family can further reduce any noise that the device can propagate to other

components. R(F) in Figure 8-3 must be less than 5 kΩ and C(F) must be greater than 10 nF.

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TMP112

SBOS473J – MARCH 2009 – REVISED FEBRUARY 2024

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