| 전자부품 데이터시트 검색엔진 |
|
MPC866 데이터시트(PDF) 92 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC866 데이터시트(HTML) 92 Page - Freescale Semiconductor, Inc |
|
92 / 96 page ![]() MPC866/MPC859 Hardware Specifications, Rev. 2 92 Freescale Semiconductor Mechanical Data and Ordering Information 15.2 Mechanical Dimensions of the PBGA Package For more information on the printed-circuit board layout of the PBGA package, including thermal via design and suggested pad layout, please refer to Plastic Ball Grid Array Application Note (order number: AN1231/D) available from your local Freescale sales office. Figure 79 shows the mechanical dimensions of the PBGA package. Figure 79. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition for MPC866XZP, MPC859PZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb 2%Ag |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |