MPC8250VR datasheet(55/60 Pages) FREESCALE

55 / 60 page

MPC8250 Hardware Specifications, Rev. 1

Freescale Semiconductor

Package Description

The following sections provide the package parameters and mechanical dimensions.

5.1

Package Parameters

Package parameters are provided in Table 22.

THERMAL14

C23

I/O power

E6, F6, H6, L5, L6, P6, T6, U6, V5,

Y5, AA6, AA8, AA10, AA11, AA14,

AA16, AA17, AB19, AB20, W21,

U21, T21, P21, N21, M22, J22,

H21, F21, F19, F17, E16, F14,

E13, E12, F10, E10, E9

Core Power

L3, V4, W3, AC11, AD11, AB15,

U25, T24, J24, H25, F23, B19,

D17, C17, D10, C10

Ground

A2, B1, B2, A5, C5, C18, D4, D6,

G2, L4, P1, R1, R4, AC4, AE7,

AC23, Y25, N24, J23, A23, D23,

D20, E18, A13, A16, K10, K11,

K12, K13, K14, K15, K16, K17,

L10, L11, L12, L13, L14, L15, L16,

L17, M10, M11, M12, M13, M14,

M15, M16, M17, N10, N11, N12,

N13, N14, N15, N16, N17, P10,

P11, P12, P13, P14, P15, P16,

P17, R10, R11,R12, R13, R14,

R15, R16, R17, T10, T11, T12,

T13, T14, T15, T16, T17, U10,

U11, U12, U13, U14, U15, U16,

U17

The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive

DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.

Must be pulled down or left floating.

If PCI is not desired, must be pulled up or left floating.

For information on how to use this pin, refer to

MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D).

Table 22. Package Parameters

Package

Devices

Outline

(mm)

Type

Interconnects

Pitch

(mm)

Nominal Unmounted

Height (mm)

MPC8250

37.5 x 37.5

TBGA

480

1.27

1.55

MPC8250VR

27 x 27

PBGA

516

2.25

Table 21. MPC8250 VR Package Pinout List (continued)

Pin Name

Ball

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