BAS70_1PS7XSB70_SER_8

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet

Rev. 08 — 4 May 2006

11 of 20

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

10. Soldering

Dimensions in mm

Fig 14. Reflow soldering footprint SOD323 (SC-76)

Dimensions in mm

Fig 15. Wave soldering footprint SOD323 (SC-76)

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 16. Reflow soldering footprint SOD523 (SC-79)

msa433

1.65

0.50

(2

×)

2.10

1.60

2.80

0.60

3.05

0.50

0.95

solder lands

solder resist

occupied area

solder paste

MSA415

1.40

4.40

5.00

1.20

2.75

solder lands

solder resist

occupied area

preferred transport direction during soldering

MGS343

solder lands

solder resist

occupied area

solder paste

1.80

1.90

0.30

0.40

0.50

1.20

0.60

2.15