©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

KEMET offers Multilayer Ceramic Chip Capacitors

packaged in 8mm and 12mm plastic tape on 7" and

13" reels in accordance with EIA standard 481-1:

Taping of surface mount components for automatic

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 78

for details on reeling quantities for commercial chips

and page 87 for MIL-PRF-55681 chips.

CERAMIC CHIP CAPACITORS

Packaging Information

Tape & Reel Packaging

8mm ±.30

(.315 ±.012")

or

12mm ±.30

(.472 ±.012")

178mm (7.00")

or

330mm (13.00")

Anti-Static Reel

Embossed Carrier*

0402 and 0603 case sizes

available on punched paper only.

Embossment

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

Chip Orientation

in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

* Punched paper carrier used for 0402 and 0603 case size.

g

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 81

for details on reeling quantities for commercial chips

and page 90 for MIL-PRF-55681 chips.

KEMET

®

X

C

G

Z

Y

Grid

placement

courtyard

Z

2.14

2.78

3.30

4.50

4.50

5.90

5.90

7.00

7.00

G

0.28

0.68

0.70

1.50

1.50

2.30

2.30

3.30

3.30

X

0.74

1.08

1.60

2.00

2.90

3.70

6.90

5.50

6.80

Y(ref)

0.93

1.05

1.30

1.50

1.50

1.80

1.80

1.85

1.85

C(ref)

1.21

1.73

2.00

3.00

3.00

4.10

4.10

5.15

5.15

Z

3.18

3.70

4.90

4.90

G

0.68

0.70

1.50

1.50

X

0.80

1.10

1.40

2.00

Y(ref)

1.25

1.50

1.70

1.70

Smin

1.93

2.20

3.20

3.20

Wave Solder

Reflow Solder

Calculation Formula

Z = Lmin + 2Jt + Tt

G = Smax - 2Jh -Th

X = Wmin + 2Js + Ts

Tt, Th, Ts = Combined tolerances

0402

0603

0805

1206

1210

1812

1825

2220

2225

Dimension

Not Recommended

Not Recommended

C

X

Grid

Placement

Courtyard

G

Y

Z

SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM

93