Data Sheet

LT8350S

analog.com

Rev. A

8 of 36

ESD Ratings

Table 3. ESD Ratings for LT8350S

ESD Model

Withstand Threshold (V)

HBM

±4000

CDM

±1250

ESD Caution

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can

discharge without detection. Although this product features patented or proprietary

protection circuitry, damage may occur on devices subjected to high-energy ESD.

Therefore, proper ESD precautions should be taken to avoid performance degradation or

loss of functionality.

PACKAGE INFORMATION

Table 4. Thermal Resistance on EVAL-LT8350S-AZ

Thermal Resistance, Four-Layer Board

Junction-to-Ambient (θJA)

19°C/W

Junction-to-Case (θJCtop)

28°C/W

Junction-to-Case Thermal Resistance (ΨJT)

0.6°C/W

Table 5. Thermal Resistance on JEDEC Board

Thermal Resistance, Four-Layer Board4

Junction-to-Ambient (θJA)

30°C/W

Junction-to-Case (θJCtop)

28°C/W

Junction-to-Case (ΨJT)

0.7°C/W

4

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board.

For the latest package outline information and land patterns (footprints), go to https://www.analog.com/en/design-

center/packaging-quality-symbols-footprints/package-index.html. Note that a “+”, “#”, or “-” in the package code indicates

RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless

of RoHS status.

Package thermal resistances were obtained using the evaluation kit, a four-layer board. For detailed information on package

thermal considerations, refer https://www.analog.com/en/resources/technical-articles/thermal-characterization-of-ic-

packages.html.