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RF5152PCBA-41X 데이터시트(PDF) 3 Page - RF Micro Devices

부품명 RF5152PCBA-41X
상세설명  3V TO 3.6V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER
PDF  10 Pages
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제조업체  RFMD [RF Micro Devices]
홈페이지  http://www.rfmd.com
Logo RFMD - RF Micro Devices

RF5152PCBA-41X 데이터시트(HTML) 3 Page - RF Micro Devices

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RF5152
Rev A10 DS061221
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Pin
Function
Description
Interface Schematic
1NC
Not connected. May be connected to ground (GND).
2RF IN
RF input. See evaluation board schematic for details.
3RF IN
RF input. See evaluation board schematic for details.
4NC
Not connected. Note: Connection of VC1 at this pin will not damage the
RF5152 or adversely affect RF5152 performance.
5VCC
Supply voltage for the bias reference and control circuits. May be con-
nected with VC1, VC2 and VC3 with a single-supply voltage as long as VCC
does not exceed 3.3VDC in this configuration.
6VB1/VB2
Bias current control voltage for the first and second stages.
7VB3
Bias current control voltage for the third stage.
8NC
Not connected.
9PDETECT
Provides an output voltage proportional to the output RF level.
10
RF OUT
RF output. The output requires external matching components which con-
sist of a one or two shunt capacitors and a series capacitor for DC blocking.
11
RF OUT
Same as pin 10.
See pin 10.
12
RF OUT/
VC3
RF output and bias for the output stage. The power supply for the output
transistor needs to be supplied to this pin. This can be done through a
quarter-wave (
λo/4) length microstrip line that is RF grounded at the other
end, or through an RF inductor that supports the required DC current. See
evaluation board schematic.
See pin 10.
13
NC
Not connected. May be connected to ground (GND).
14
VC2
Second stage power supply input. Connect as shown on evaluation board
schematic.
15
NC
Not connected. May be connected to ground (GND).
16
VC1
First stage power supply input. Connect as shown on evaluation board
schematic.
Pkg
Base
GND
Ground connection. The back side of the package should be connected to
the ground plane through as short a connection as possible (e.g., PCB vias
under the device are required).
RF OUT
BIAS



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