SPX1117HM3 datasheet(6/16 Pages) SIPEX

6 / 16 page

Apr 20-07 Rev B

SPX1117 800mA Low Dropout Voltage Regulator

Output Capacitor

To ensure the stability of the SPX1117, an

output capacitor of at least 2.2

µF (tantalum or

ceramic) or 10

µF (aluminum) is required. The

value may change based on the application

requirements of the output load or temperature

range. The value of ESR can vary based on the

type of capacitor used in the applications to

guarantee stability. The recommended value

for ESR is 0.5

Ω or less. A larger value of

output capacitance (up to 100

µF) can improve

the load transient response.

Soldering Methods

The SPX1117 SOT-223 package is designed

to be compatible with infrared reflow or

vapor-phase reflow soldering techniques.

During soldering, the non-active or mildly

active fluxes may be used. The SPX1117 die

is attached to the heatsink lead which exits

opposite the input, output, and ground pins.

Hand soldering and wave soldering should be

avoided since these methods can cause

damage to the device with excessive thermal

gradients on the package. The SOT-223

recommended soldering method are as

follows: vapor phase reflow and infrared

reflow with the component preheated to within

°C of the soldering temperature range.

Figure 16. Load Step Response (0 to 800mA), Vin=3.3V,

Vout=1.8V, Cin=10

µF, Cout=2.2µF, Ceramic; 1 = Vout,

4= Iload

Figure 17. Load Step Response (0 to 800mA), Vin=3.3V,

Vout=1.8V, Cin=10

µF, Cout=2.2µF, OSCON; 1 = Vout,

4= Iload

APPLICATION INFORMATION

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