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SAB9079 데이터시트(PDF) 44 Page - NXP Semiconductors |
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SAB9079 데이터시트(HTML) 44 Page - NXP Semiconductors |
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44 / 48 page ![]() 2000 Jan 13 44 Philips Semiconductors Preliminary specification Multistandard Picture-In-Picture (PIP) controller SAB9079HS PACKAGE OUTLINE UNIT A1 min. A2 A3 bp cE(1) eHE LLp y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 2.90 2.50 0.25 0.25 0.27 0.17 0.23 0.11 14.1 13.9 0.50 17.35 17.05 7 ° 0 ° 0.08 0.20 1.60 0.08 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 1.03 0.73 SOT387-3 98-03-27 D(1) 20.1 19.9 HD 23.35 23.05 pin 1 index b p e θ E A1 A L p detail X L (A ) 3 B 38 c D H b p E H A2 v M B D A e v M A 1 128 103 102 65 64 39 w M w M 0 5 10 mm scale SQFP128: plastic shrink quad flat package; 128 leads (lead length 1.6 mm); body 14 x 20 x 2.72 mm SOT387-3 A max. 3.40 X y |
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