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PACKAGE OUTLINE

C

2X 1.3

4X 0.65

10X (0.05)

6X

0.28

0.22

6X

0.54

0.46

2.4 MAX

4X 0.8 0.03

2X 1.75

4X 0.3 0.03

2X 0.9

2X 3.1

4X

0.79

0.71

4X

1.19

1.11

2X 1.15

2.4

B

3.1

2.9

A

4.1

3.9

(3.2)

(2.5)

4X (0.075)

uSIP

- 2.4 mm max height

SIL0014B

MICRO SYSTEM IN PACKAGE

4225112/E 11/2020

AREA

PIN 1 INDEX

NOTE 3

PICK AREA

0.08 C

0.1

C A B

0.05

C

1

10

SYMM

SYMM

5

6

11

12

13

14

(OPTIONAL)

PIN 1 ID

MicroSiP is a trademark of Texas Instruments

TM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Pick and place nozzle

1.3 mm or smaller recommended.

4. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.

0.1

C A B

0.05

C

SCALE 3.000