Product Specification

SL1 ICS31 01

Rev. 1.2

July 2000

Page 3 of 22

Public

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HANDLING RECOMMENDATIONS

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11.1 Sawing .................................................................................................................................. 14

11.2 Die Attach............................................................................................................................. 14

11.3 Wire Bonding....................................................................................................................... 14

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COIL SPECIFICATION

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13

ELECTRICAL SPECIFICATIONS

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HINTS FOR LABEL IC ENCAPSULATION

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14.1 Protection against Visible Light......................................................................................... 16

14.2 Protection against UV Light............................................................................................... 16

14.3 Resistance to X-Rays .......................................................................................................... 16

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INLET/LABEL CHARACTERISATION AND TEST

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15.1 Characterisation of the Inlet/Label ................................................................................... 17

15.2 Final Test of the Inlet/Label............................................................................................... 17

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APPENDIX A: DIE PLAN

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APPENDIX B: CLUSTER PLAN

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APPENDIX C: CLUSTER MAP

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APPENDIX D: WAFER MAP

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