Product Specification

SL1 ICS31 01

Rev. 1.2

July 2000

Page 16 of 22

Public

14 Hints for Label IC Encapsulation

14.1 Protection against Visible Light

As a result of the ultra low power design of the I•CODE1 Label IC some analogue circuits on the

chip are light sensitive. This means that common sun light can impact the operation of the label if

the chip is not protected against visible light radiation.

reduced operating range of the plain chip.

Measurements of direct sunlight in summer deliver values up to 260 W/m

To ensure proper operation an expected minimum radiation reduction factor of approx. 9

(2 x 260/60 = 8.7) must be provided by the encapsulation. That means special care has to be taken

to ensure a sufficient light protection of the I•CODE1 Label IC (e.g. non translucent encapsulation

or underfiller, ...) according to application requirements.

14.2 Protection against UV Light

An EEPROM memory, as it is also used in the I•CODE1 Label IC, has some principle sensitivity to

UV light (applies to EEPROM-technology in general).

Thus strong UV exposure in the production of inlets/labels has to be avoided. UV protection has to

be ensured using appropriate assembly methods.

14.3 Resistance to X-Rays

X-ray exposure on comparable Philips ICs (with even smaller feature size) caused neither a long

term influence on the behaviour of the ICs nor on the data retention of the EEPROMs.