EOL Data Sheet

8 Mbit Multi-Purpose Flash

SST39VF088

21

©2007 Silicon Storage Technology, Inc.

S71227-05-EOL

2/07

PACKAGING DIAGRAMS

Number

Description

Date

00

•

Initial Release

Mar 2003

01

•

Corrected Byte-Program 3rd Cycle Data from 20H to A0H in Table 4 on page 6

Apr 2003

02

•

Corrected Byte-Program 3rd Cycle Data from 20H to A0H in Figures 3 and 4

Jun 2003

03

•

Auto Low Power feature references removed.

(CE# toggled high achieves same effect.)

Aug 2003

04

•

2004 Data Book

Nov 2003

05

•

End of Life data sheet for all devices in S71227

Feb 2007

1.05

0.95

0.70

0.50

18.50

18.30

20.20

19.80

0.70

0.50

12.20

11.80

0.27

0.17

0.15

0.05

48-tsop-EK-8

Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,

although some dimensions may be more stringent.

2. All linear dimensions are in millimeters (max/min).

3. Coplanarity: 0.1 mm

4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.

1.20

max.

1mm

0˚- 5˚

DETAIL

Pin # 1 Identifier

BSC