7.3 Power Supply Recommendations

The OPAx596 operates from power supplies up to ±42.5V (85V), and as little as ±4V (8V) with excellent

performance. Most behavior remains unchanged throughout the full operating voltage range. A power-supply

bypass capacitor of at least 0.1µF is required for proper operation. Ensure that the capacitor voltage is rated for

high voltage across the full operating temperature range. Some applications do not require an equal positive and

negative output voltage swing. The OPAx596 can be powered with asymmetrical supplies.

7.4 Layout

7.4.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including the following

guidelines:

• Noise can propagate into analog circuitry through the power pins of the op amp and the circuit as a

whole. Connect low-ESR, 0.1µF ceramic bypass capacitors between each supply pin and ground. Place

the capacitors as close to the device as possible. A single bypass capacitor from V+ to ground is sufficient for

single supply applications.

• Separate grounding for analog and digital portions of circuitry is one of the simplest and most effective

methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.

A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital

and analog grounds paying attention to the flow of the ground current.

• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If

these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as opposed

to in parallel with the noisy trace.

• Place the external components as close to the device as possible.

• Keep the length of input traces as short as possible. Always remember that the input traces are the most

sensitive part of the circuit.

• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce

leakage currents from nearby traces that are at different potentials.

• Clean the PCB following board assembly for best performance.

• Any precision integrated circuit can experience performance shifts due to moisture ingress into the plastic

package. Following any aqueous PCB cleaning process, baking the PCB assembly is recommended to

remove moisture introduced into the device packaging during the cleaning process. A low temperature, post

cleaning bake at 85°C for 30 minutes is sufficient for most circumstances.

OPA596

SBOSA42 – JUNE 2024

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