RT5752

11

DS5752-03 November 2023

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Copyright 2023 Richtek Technology Corporation. All rights reserved.

is a registered trademark of Richtek Technology Corporation.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Thermal Shutdown

Thermal Shutdown Threshold

TSD

--

150

--

C

Thermal Shutdown Hysteresis

TSD

--

20

--

Power Good

Power Good High Threshold

VTH_PGLH

VFB rising, PG goes high

83

90

--

%

Power Good Falling Threshold

VTH_PGHL

VFB falling, PG goes low

78

85

--

%

Power Good Sink Current

Capability

IPG sinks 5mA

--

--

0.4

V

Output Discharge Resistor

Output Discharge Switch

On-Resistor

RDISCHG

VEN = 0V (Protection)

--

100

--



Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond those

indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating

conditions may affect device reliability.

Note 2.

Devices are ESD sensitive. Handling precautions are recommended.

Note 3.

The device is not guaranteed to function outside its operating conditions.

Note 4.

For more information about thermal parameter, see the Application and Definition of Thermal Resistances report,

AN061.

Note 5.

θJA(EVB), ψJC(Top) and ψJB are measured on a high effective-thermal-conductivity four-layer test board which is in size of

70mm x 50mm; furthermore, all layers with 1 oz. Cu. Thermal resistance/parameter values may vary depending on the

PCB material, layout, and test environmental conditions.