NOTES:

1.

DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 2018.

2.

CONTROLLING DIMENSION:

MILLIMETERS.

3.

DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR

BURRS. MOLD FLASH PROTRUSIONS

OR GATE BURRS SHALL NOT EXCEED

0.150mm PER SIDE.

4.

DIMENSIONS D AND E ARE

DETERMINED AT THE OUTERMOST

EXTREMES OF THE PLASTIC BODY.

*FOR ADDITIONAL INFORMATION ON OUR

PB−FREE STRATEGY AND SOLDERING

DETAILS, PLEASE DOWNLOAD THE ONSEMI

SOLDERING AND MOUNTING TECHNIQUES

REFERENCE MANUAL, SOLDERRM/D.

LFPAK4 4.90x4.15x1.15MM, 1.27P

CASE 760AB

ISSUE D

DATE 22 MAY 2024

XXXXXX = Specific Device Code

A

= Assembly Location

WL

= Wafer Lot

Y

= Year

W

= Work Week

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer

to device data sheet for actual part

marking. Some products may not follow

the Generic Marking.

XXXXXX

XXXXXX

AWLYW

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON82777G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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