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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PI3033B 데이터시트(PDF) 3 Page - AMI SEMICONDUCTOR |
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PI3033B 데이터시트(HTML) 3 Page - AMI SEMICONDUCTOR |
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3 / 13 page  Preliminary PI3033B datasheet Bonding Pad Outputs Locations and Die Dimensions Figure 2 shows image sensors die dimension and the bonding pad locations for PI3033B Sensor Chip. The location is referenced to the lower left corner of the die. Note RSTLV, bias, pad is not used. Figure 2. Bonding Pad and Chip Layout: Page 3 of 13 Date: 03/18/05 |
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