LTC6991

21

Rev. D

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PACKAGE DESCRIPTION

3.00 ±0.10

(2 SIDES)

2.00 ±0.10

(2 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40 ±0.10

BOTTOM VIEW—EXPOSED PAD

1.65 ±0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

R = 0.05

TYP

1.35 ±0.10

(2 SIDES)

1

3

6

4

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DCB6) DFN 0405

0.25 ±0.05

0.50 BSC

PIN 1 NOTCH

R0.20 OR 0.25

× 45° CHAMFER

0.25 ±0.05

1.35 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65 ±0.05

(2 SIDES)

2.15 ±0.05

0.70 ±0.05

3.55 ±0.05

PACKAGE

OUTLINE

0.50 BSC

DCB Package

6-Lead Plastic DFN (2mm

× 3mm)

(Reference LTC DWG # 05-08-1715 Rev A)