EM1109BV

2020/12/30

A.1

4

Absolute Maximum Ratings (Note1)

 V

IN

---------------------------------------------------------------------------------------------------

-0.3V to +6.0V

 Other Pins

------------------------------------------------------------------------------------------

6V

 Power Dissipation, PD @ TA = 25

C, DFN3X3-8L ----------------------------------------------- 1.7W

 Package Thermal Resistance,

θJA, DFN3X3-08L (Note 2) --------------------------------------

70

C/W

 Package Thermal Resistance,

θJC, DFN3X3-08L (Note 2) --------------------------------------

5

C/W

 Junction Temperature

-------------------------------------------------------------------------------

150

C

 Lead Temperature (Soldering, 10 sec.)

-----------------------------------------------------------

260°C



Storage Temperature Range --------------------------------------------------------------------

-65°C to 150°C

 ESD susceptibility (Note3)

HBM (Human Body Mode) ----------------------------------------------------------------------

2KV

MM (Machine Mode) -----------------------------------------------------------------------------

200V

CDM (Charge Device Mode) ---------------------------------------------------------------------

1KV

Recommended Operating Conditions (Note4)

 Supply Input Voltage, V

IN

--------------------------------------------------------------------------- +2.5 to +5.5V

 Junction Temperature

------------------------------------------------------------------------------- 40C to 125C

 Ambient Temperature

------------------------------------------------------------------------------- 40C to 85C