2016/02/24

A.2

4

EM5845

POK

POK Upper Trip Threshold

VPOKU

110

%

POK Lower Trip Threshold

VPOKL

90

%

POK Delay

TD_POK

1

ms

POK Leakage Current

IL_POK

1

uA

Protection section

FB Under Voltage Protection

VFB_UVP FB falling

50

60

70

%

UVP delay time

TD_UVP

7.5

10

us

FB Over Voltage Protection

VFB_OVP FB rising

120

130

140

%

OVP delay time

TD_OVP

7.5

10

us

Soft-Start Interval

TSS

0.6

1

2

ms

VOUT Discharge Resistance

100

Ω

Thermal Shutdown

TSD

150

℃

Thermal Shutdown Hysteresis

TSD_HYS

30

℃

Note 1.

Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for

stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational

sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain

possibility to affect device reliability.

Note 2.

θJA is measured in the natural convection at TA=25

oC on a 4-layers high effective thermal conductivity test board with

minimum copper area of JEDEC 51-7 thermal measurement standard.

Note 3.

Devices are ESD sensitive. Handling precaution is recommended.

Note 4.

The device is not guaranteed to function outside its operating conditions.

Reference Values of Feedback Networks and output LC filter combination

VOUT(V)

R1(kΩ)

R2(kΩ)

L (uH)

COUT (uF)

*CFF(pF)

3.3

37

8.2

2.2

44

22p~470p

1.8

16.5

8.2

1.5

22

1.2

8.2

8.2

1.5

22

1.05

6.2

8.2

1.5

22

1

5.6

8.2

1.5

22

* CFF is chosen for improving the transient load response