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U556-7

Document Number: IF35329.R00

InterFET Corporation

June, 2019

InterFET

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U556-7

TO-18 Mechanical and Layout Data

Package Outline Data

Suggested Through-Hole Layout

1.

All linear dimensions are in millimeters.

2.

Package weight approximately 0.29 grams

3.

Bulk product is shipped in standard ESD shipping

material

4.

Refer to JEDEC standards for additional

information.

1.

All linear dimensions are in millimeters.

2.

The suggested land pattern dimensions have been

provided as a straight lead reference only. A more

robust pattern may be desired for wave soldering

and/or bent lead configurations.