Data Sheet

AD536A

Rev. G | Page 5 of 15

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

Dual Supply

±18 V

Single Supply

+36 V

Internal Power Dissipation

500 mW

Maximum Input Voltage

±25 V peak

Buffer Maximum Input Voltage

±VS

Maximum Input Voltage

±25 V peak

Storage Temperature Range

−55°C to +150°C

Operating Temperature Range

AD536AJ/AD536AK

0°C to +70°C

AD536AS

−55°C to +125°C

Lead Temperature (Soldering, 60 sec)

300°C

ESD Rating

1000 V

Thermal Resistance θJA1

10-Pin Header (H-10 Package)

150°C/W

20-Terminal LCC (E-20 Package)

95°C/W

14-Lead SBDIP (D-14 Package)

95°C/W

14-Lead CERDIP (Q-14 Package)

95°C/W

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

ESD CAUTION

1 θJA is specified for the worst-case conditions, that is, a device soldered in a

circuit board for surface-mount packages.

PAD NUMBERS CORRESPOND TO PIN NUMBERS FOR THE

TO-100 14-LEAD CERAMIC DIP PACKAGE.

1BOTH PADS SHOWN MUST BE CONNECTED TO VIN.

THE AD536A IS AVAILABLE IN LASER-TRIMMED CHIP FORM.

SUBSTRATE CONNECTED TO –VS.

+VS

14

VIN

1A1

VIN

1B1

COM

10

IOUT

8

BUF IN

7

BUF OUT

6

dB

5

CAV

4

–VS

3

RL

9

0.1315 (3.340)

0.0807

(2.050)

Figure 2. Die Dimensions and Pad Layout

Dimensions shown in inches and (millimeters)