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Table 2. Bump Coordinates (bumps down, from center of die, dimensions in microns).

Note: VREF PAD can be left floating or grounded. DO NOT CONNECT IT ANYWHERE ELSE.

Pin name

X-coord (um)

Y-coord (um)

Pin name

X-coord (um)

Y-coord (um)

HR3Y

471

1140

VREF

-278

-1140

HR3X

775

1140

GND

-482

-1140

HW3Y

141.1

813.7

VEE

-686

-1140

HW3X

141.1

566.7

FLT

-890

-816

HW2X

141.1

362.7

RXW

-890

-612

HW2Y

141.1

115.7

SDATA

-890

-408

HR2Y

686

102

RDY

-890

-204

HR2X

890

252

RDX

-890

0

HR1X

890

-252

SCLK

-890

204

HR1Y

686

-102

WDX

-890

408

HW1Y

141.1

-115.7

WDY

-890

612

HW1X

141.1

-362.7

SDEN

-890

816

HW0X

141.1

-566.7

TFI

-686

1140

HW0Y

141.1

-813.7

VEE

-482

1140

HR0X

775

-1140

GND

-278

1140

HR0Y

471

-1140

VCC

-74

1140

VCC

-74

-1140

-

-

-