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TDA8376 데이터시트(PDF) 17 Page - NXP Semiconductors |
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TDA8376 데이터시트(HTML) 17 Page - NXP Semiconductors |
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17 / 44 page ![]() 1996 Jan 26 17 Philips Semiconductors Objective specification I2C-bus controlled PAL/NTSC TV processors TDA8376; TDA8376A 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Notes 1. All pins are protected against ESD by means of internal clamping diodes. 2. Human Body Model (HBM): R = 1.5 k Ω; C = 100 pF. 3. Machine Model (MM): R = 0 Ω; C = 200 pF. 10 THERMAL CHARACTERISTICS 11 QUALITY SPECIFICATION In accordance with “SNW-FQ-611E”. The number of the quality specification can be found in the “Quality Reference Handbook”. The handbook can be ordered using the code 9398 510 63011. 11.1 Latch-up At Tamb =70 °C all pins meet the following specification. • Itrigger ≥ 100 mA or ≥1.5VDD(max) • Itrigger ≤−100 mA or ≤−0.5VDD(max). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage − 9.0 V Tstg storage temperature −25 +150 °C Tamb operating ambient temperature 0 70 °C Tsol soldering temperature for 5 s − 260 °C Tj operating junction temperature − 150 °C Ves electrostatic handling all pins; notes 1 and 2 −2000 +2000 V all pins; notes 1 and 3 −200 +200 V SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air SDIP52 40 K/W QFP64 50 K/W |
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