3.2

Stencil opening design

Figure 14. Footprint - 3 mils stencil -non solder mask

defined

Copper pad diameter:

220 µm recommended

180 µm minimum

260 µm maximum

Solder mask opening:

320 µm recommended

300 µm minimum

340 µm maximum

Solder stencil opening:

220 µm recommended

Figure 15. Footprint - 3 mils stencil - solder mask defined

Copper pad diameter:

220 µm recommended

180 µm minimum

260 µm maximum

Solder mask opening:

320 µm recommended

300 µm minimum

Solder stencil opening:

220 µm recommended

Figure 16. Footprint - 5 mils stencil -non solder mask

defined

*depending on paste, it can go down to 270 µm

Copper pad diameter:

220 µm recommended

180 µm minimum

260 µm maximum

Solder mask opening:

320 µm recommended

300 µm minimum

340 µm maximum

Solder stencil opening:

330 µm recommended*

Figure 17. Footprint - 5 mils stencil - solder mask defined

*depending on paste, it can go down to 270 µm

Copper pad diameter:

220 µm recommended

180 µm minimum

260 µm maximum

Solder mask opening:

320 µm recommended

300 µm minimum

Solder stencil opening:

330 µm recommended*

3.3

Solder paste

1.

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste is recommended.

3.

Offers a high tack force to resist component movement during high speed.

4.

Use solder paste with fine particles: powder particle size 20-38 µm.

BALF-SPI2-02D3

Stencil opening design

DS12508 - Rev 1

page 9/13