TC1301A/B

DS21798B-page 22

© 2005 Microchip Technology Inc.

8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN)

Exposed Pad Length

Exposed Pad Width

Contact Length

Contact Width

Overall Width

D2

E2

L

b

D

.019

.012

.008

.063

.053

.010

.118 BSC

Number of Pins

Standoff

Contact Thickness

Overall Length

Overall Height

Pitch

p

n

Units

A

A1

E

A3

8

.000

.001

.008 REF.

.118 BSC

.031

.026 BSC

MIN

INCHES

NOM

0.48

0.26

0.30

.022

.073

.015

.063

0.20

1.60

1.34

0.55

0.37

1.85

1.59

0.02

0.80

3.00 BSC

3.00 BSC

0.20 REF.

0.65 BSC

MILLIMETERS*

.002

.039

0.00

MIN

MAX

NOM

8

0.05

1.00

MAX

n

0.90

.035

(Note 3)

(Note 3)

.059

.069

1.75

1.49

D2

E

*Controlling Parameter

Drawing No. C04-062

Notes:

Exposed pad dimensions vary with paddle size.

A1

A

A3

Dimension Limits

TOP VIEW

EXPOSED

METAL

PAD

BOTTOM VIEW

2

1

ID INDEX

PIN 1

D

L

E2

p

b

n

3.

Package may have one or more exposed tie bars at ends.

1.

AREA

Pin 1 visual index feature may vary, but must be located within the hatched area.

2.

(NOTE 2)

TIE BAR

(NOTE 1)

EXPOSED

4. JEDEC equivalent: MO-229

Revised 05/24/04