© 2005 Microchip Technology Inc.

DS21893C-page 21

MCP73861/2/3/4

16-Lead Plastic Quad Flat No-Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated

2

1

n

D

E

E2

D2

e

b

L

A

A3

EXPOSED

METAL

PAD

OPTIONAL

INDEX

AREA

TOP VIEW

BOTTOM VIEW

(NOTE 2)

(NOTE 1)

A1

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

JEDEC equivalent: M0-220

See ASME Y14.5M

See ASME Y14.5M

Revised 07-21-05

* Controlling Parameter

Notes:

INCHES

NOM

.026 BSC

.008 REF

Number of Pins

Overall Height

Overall Width

Contact Width

Overall Length

Contact Length

Exposed Pad Width

Exposed Pad Length

Contact Thickness

Pitch

Standoff

Units

Dimension Limits

e

E2

b

L

D2

D

A3

E

A1

A

.090

.010

.012

.152

.090

.152

.000

.031

MIN

n

MIN

.104

.157

.012

.104

.016

.035

.157

.001

.106

.014

.163

.106

.020

.039

.163

.002

MAX

16

0.65 BSC

0.20 REF

2.29

3.85

0.25

2.29

0.30

0.80

3.85

0.00

2.64

0.30

4.00

2.64

0.40

0.90

4.00

0.02

NOM

MILLIMETERS*

16

2.69

0.35

4.15

2.69

0.50

1.00

4.15

0.05

MAX

Pin 1 visual index feature may vary, but must be located within the hatched area.

Exposed pad varies according to die attach paddle size.

2.

1.

Drawing No. C04-127