© 2005 Microchip Technology Inc.

DS21974A-page 21

TC1313

10-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

E2

D

A1

A

A3

TOP VIEW

EXPOSED

METAL

PAD

BOTTOM VIEW

21

ID INDEX

PIN 1

E

L

D2

p

b

n

AREA

(NOTE 2)

TIE BAR

(NOTE 1)

EXPOSED

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package may have one or more exposed tie bars at ends.

Overall Length

Lead Thickness

Overall Width

Exposed Pad Length

Exposed Pad Width

Lead Width

Lead Length

D

b

L

D2

E2

A3

E

Overall Height

Number of Pins

Pitch

Standoff

n

A

A1

e

Dimension Limits

Units

1.65

2.39

3.00

3.00

0.90

MILLIMETERS*

0.50 BSC

0.20 REF.

0.02

0.25

0.40

.118

.112

.008

.012

.051

.010

.016

.065

.008 REF.

.082

.112

.094

.118

.124

2.85

1.30

0.18

0.30

.015

.020

.067

2.85

2.08

.096

.124

MAX

10

.020 BSC

.031

.000

.035

.001

NOM

INCHES

MIN

0.00

0.80

.039

.002

MIN

NOM

3.15

1.70

0.30

0.50

3.15

2.45

10

1.00

0.05

MAX

2. REF: Reference Dimension, usually without tolerance, for information purposes only.

1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Exposed pad varies according to die attach paddle size.

Drawing No. C04-063, Revised 05-05-05

*Controlling Parameter

See ASME Y14.5M

See ASME Y14.5M

JEDEC equivalent: Not Registered

Notes: