© 2007 Microchip Technology Inc.

DS22008B-page 19

MCP1702

3-Lead Plastic Transistor Outline (TO) [TO-92]

Notes:

1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

MAX

Number of Pins

N

3

Pitch

e

.050 BSC

Bottom to Package Flat

D

.125

.165

Overall Width

E

.175

.205

Overall Length

A

.170

.210

Molded Package Radius

R

.080

.105

Tip to Seating Plane

L

.500

–

Lead Thickness

c

.014

.021

Lead Width

b

.014

.022

E

A

N

1

L

b

e

c

R

D

1 2

3

Microchip Technology Drawing C04-101B