| 전자부품 데이터시트 검색엔진 |
|
MCP1406-E/AT 데이터시트(PDF) 10 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
MCP1406-E/AT 데이터시트(HTML) 10 Page - Microchip Technology |
|
10 / 22 page ![]() MCP1406/07 DS22019A-page 10 © 2006 Microchip Technology Inc. 4.0 APPLICATION INFORMATION 4.1 General Information MOSFET drivers are high-speed, high current devices which are intended to provide high peak currents to charge the gate capacitance of external MOSFETs or IGBTs. In high frequency switching power supplies, the PWM controller may not have the drive capability to directly drive the power MOSFET. A MOSFET driver like the MCP1406/07 family can be used to provide additional drive current capability. 4.2 MOSFET Driver Timing The ability of a MOSFET driver to transition from a fully off state to a fully on state are characterized by the drivers rise time (tR), fall time (tF), and propagation delays (tD1 and tD2). The MCP1406/07 family of devices is able to make this transition very quickly. Figure 4-1 and Figure 4-2 show the test circuits and timing waveforms used to verify the MCP1406/07 tim- ing. FIGURE 4-1: Inverting Driver Timing Waveform. FIGURE 4-2: Non-Inverting Driver Timing Waveform. 4.3 Decoupling Capacitors Careful layout and decoupling capacitors are highly recommended when using MOSFET drivers. Large currents are required to charge and discharge capacitive loads quickly. For example, 2.25A are needed to charge a 2500 pF load with 18V in 20 ns. To operate the MOSFET driver over a wide frequency range with low supply impedance, a ceramic and low ESR film capacitor are recommended to be placed in parallel between the driver VDD and GND. A 1.0 µF low ESR film capacitor and a 0.1 µF ceramic capacitor placed between pins 1, 8 and 4, 5 should be used. These capacitors should be placed close to the driver to minimized circuit board parasitics and provide a local source for the required current. 4.4 PCB Layout Considerations Proper PCB layout is important in a high current, fast switching circuit to provide proper device operation and robustness of design. PCB trace loop area and inductance should be minimized by the use of a ground plane or ground trace located under the MOSFET gate drive signals, separate analog and power grounds, and local driver decoupling. 0.1 µF +5V 10% 90% 10% 90% 10% 90% 18V 1µF 0V 0V MCP1406 CL = 2500 pF Input Input Output tD1 tF tD2 Output tR V DD = 18V Ceramic 90% Input tD1 tF tD2 Output tR 10% 10% 10% +5V 18V 0V 0V 90% 90% 0.1 µF 1µF MCP1407 CL = 2500 pF Input Output V DD = 18V Ceramic |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |